As electronic devices rapidly evolve towards higher power, greater integration, and miniaturization, thermal management has become a critical bottleneck in ensuring product performance, reliability, and lifespan. SIFOC New Materials (Shenzhen) Co., Ltd., deeply rooted in the field of thermal materials, leverages its profound technical expertise and innovative spirit to introduce the SFSG series of single-component thermal gels. This series provides an efficient, reliable, and convenient solution to complex heat dissipation challenges. With its excellent thermal conductivity, ultra-low oil separation, and outstanding ease of application, the SFSG series is becoming the ideal choice for numerous fields, including consumer electronics, new energy vehicles, communication equipment, and industrial control.
I. Precise Specification Matrix: Covering All-Scenario Thermal Dissipation Needs
The SIFOC SFSG series of thermal gels is a low oil separation, single-component, gel-like thermal material meticulously formulated from metal oxides and high-performance silicone grease. Its core advantage lies in precisely matching the thermal dissipation requirements of devices with varying power densities, offering a complete gradient of thermal conductivity from 1.0 W/m·K to 8.0 W/m·K:
Model | Thermal Conductivity (W/m·K) | Thermal Resistance@20PSI (℃·in²/W) | Density (g/cm³) | Color | Extrusion Rate@30cc,90PSI (g/min) | Volume Resistivity (Ω·cm) | Oil Separation@150℃/24h (%) | Volatilization@150℃/24h (%) | Operating Temp. Range (℃) |
SFSG100 | 1.0 | 0.07 | 2.0±0.2 | Pink | 40±10 | ≥10⁸ | ≤1 | ≤1 | -40~150 |
SFSG200 | 2.0 | 0.06 | 2.8±0.2 | Pink | 40±10 | ≥10⁸ | ≤1 | ≤1 | -40~150 |
SFSG300 | 3.0 | 0.055 | 3.0±0.2 | Pink | 40±10 | ≥10⁸ | ≤1 | ≤1 | -40~150 |
SFSG400 | 4.0 | 0.053 | 3.1±0.2 | Pink | 40±10 | ≥10⁸ | ≤1 | ≤1 | -40~150 |
SFSG500 | 5.0 | 0.051 | 3.3±0.2 | Pink | 40±10 | ≥10⁸ | ≤1 | ≤1 | -40~150 |
SFSG600 | 6.0 | 0.048 | 3.4±0.2 | Light Blue | 30±10 | ≥10⁸ | ≤1 | ≤1 | -40~150 |
SFSG800 | 8.0 | 0.042 | 3.5±0.2 | Gray | 30±10 | ≥10⁸ | ≤1 | ≤1 | -40~150 |
SFSG1000 | 8.0 | 0.042 | 3.5±0.2 | Gray | 30±10 | ≥10⁸ | ≤1 | ≤1 | -40~150 |
Key Specification Highlights:
1. Excellent Thermal Performance: Ranging from the entry-level 1.0 W/m·K to the flagship 8.0 W/m·K, it meets the dissipation needs from low-power chips to high-power IGBTs, CPUs/GPUs. Thermal conductivity and resistance are strictly tested according to ASTM D5470, ensuring reliable data.
2. Ultra-Low Oil Separation (≤1%): Significantly superior to traditional silicone greases, it eliminates the risk of PCB contamination and contact short circuits caused by oil bleeding, enhancing the long-term operational reliability of devices.
3. Superior Electrical Insulation (≥10⁸ Ω·cm): Suitable for applications requiring electrical isolation, ensuring safety.
4. Wide Temperature Range Stability (-40℃ ~ 150℃): Maintains stable performance under harsh environments, fearless of high and low-temperature cycling challenges.
5. Controllable Application: Low-to-medium conductivity models (100-500) have an extrusion rate of approx. 40g/min, while high-conductivity models (600-1000) are approx. 30g/min, balancing fluidity and positioning, and supporting automated dispensing.
6. Low Volatilization (≤1%): Minimal volatilization at high temperatures prevents contamination within sealed spaces or impact on optical devices.
II. Broad Application Scenarios: Empowering Thermal Management Upgrades Across Industries
With its performance gradient and reliability, the SIFOC SFSG series excels in the following key areas:
1. Consumer Electronics:
· Smartphones/Tablets/Laptops: SFSG100/SFSG200 are suitable for medium-to-low power heat sources like CPUs, camera modules, and fast-charging chips. Their low oil separation property protects delicate internal components.
· Wearable Devices: The ideal choice for miniaturized, low-power devices (e.g., watches, earphones), with SFSG100 providing basic thermal protection.
· AR/VR Devices: For near-eye display modules and main processors, SFSG200/SFSG300 can efficiently export heat, improving wearing comfort.
2. New Energy Vehicles (NEVs):
· Electronic Control Systems (MCU/DCDC/OBC): SFSG300/SFSG400 effectively dissipate heat from power devices, ensuring the efficient and stable operation of electronic control systems.
· Battery Management Systems (BMS): SFSG200/SFSG300 are used for heat dissipation in sampling harnesses and main control chips, with their insulation ensuring safety.
· Smart Cockpit and Domain Controllers: High-performance computing platforms (e.g., cockpit SoCs, autonomous driving domain controllers) rely on SFSG500/SFSG600 for powerful heat dissipation.
3. Communication Equipment & Data Centers:
· 5G Base Stations: For heat dissipation in AAU massive MIMO power amplifiers and baseband processing units (BBU), SFSG400/SFSG500/SFSG600 tackle high heat flux density challenges.
· Servers/Switches: For CPUs, GPUs, ASICs, optical modules, and power modules, SFSG500/SFSG600/SFSG800/SFSG1000 provide ultimate thermal conductivity, reducing hotspot temperatures and enhancing computing stability.
· Optical Communications: For lasers and driver chips, the insulation and low oil separation of SFSG200/SFSG300 are crucial.
4. Industrial & Medical:
· Industrial Power Supplies/Inverters/PLCs: For power semiconductor heat dissipation, SFSG400/SFSG500 ensure long equipment life.
· Medical Imaging Equipment (CT/MRI/Ultrasound): For high-performance detectors and image processing boards, SFSG300/SFSG400 meet high-reliability requirements.
· LED Lighting & Drivers: For high-power COB light sources and driver power supplies, SFSG200/SFSG300 enhance luminous efficacy and lifespan.
III. Adapting to Diverse Needs: Convenient Application and Long-Term Reliability
The SIFOC SFSG series is designed with full consideration of practical application adaptability and efficiency:
1. Single-Component, Ready-to-Use: No mixing required; ready for immediate application upon opening. This simplifies the process flow, reduces human error, and improves production efficiency.
2. Excellent Thixotropy and Wettability: The gel form provides good thixotropy (high viscosity at rest, becomes thinner under stress), making it easy for dispensing or screen printing. Low surface tension ensures it can perfectly wet surfaces of various roughness (e.g., metal heat sinks, ceramic substrates, PCBs), effectively fill microscopic gaps, and minimize contact thermal resistance.
3. Long-Term Stability and Reliability:
o Ultra-low oil separation (≤1%) is a core advantage, completely solving the pain point of traditional greases where long-term use leads to oil bleeding, contaminating surrounding components, and causing performance degradation or even failure. It significantly extends equipment maintenance cycles and overall lifespan.
o Low volatilization rate (≤1%) prevents fogging contamination inside sealed devices (e.g., optical modules, sealed sensors).
o Wide operating temperature range (-40℃ ~ 150℃) and excellent aging resistance ensure performance remains as good as new in harsh working environments.
4. Automation-Friendly: Stable extrusion rates and rheological properties make it perfectly compatible with automated dispensing equipment, enabling precise, efficient, and consistent coating to meet large-scale production demands.
5. Safe and Environmentally Friendly: The main component is silicone filled with thermally conductive powder, complying with environmental regulations like RoHS, making it safe to use.
Conclusion: SIFOC Thermal Gel—The Solid Cornerstone of Thermal Management Innovation
The SIFOC SFSG series of single-component thermal gels, with its precise thermal conductivity gradient, industry-leading low oil separation, excellent long-term reliability, and convenient, efficient application characteristics, builds a powerful product matrix covering a wide range of thermal dissipation needs. From lightweight consumer electronics to demanding automotive electronics and communication infrastructure, SIFOC is committed to providing global customers with customized, stable, and reliable thermal management solutions.
Choosing SIFOC means choosing innovative material technology as your engine, empowering your products to break through thermal bottlenecks, unleash ultimate performance, and gain a market edge. We continue to explore the boundaries of thermal materials, working hand-in-hand with you to create a more efficient, reliable, and intelligent electronic future. SIFOC Thermal Gel—Providing the Cooling Power for Your Core Technology.
