Product Description
Thermally Conductive Silicone Encapsulant
OSiTC series
With the rapid development of aerospace, electronics and other high-tech fields, the integration, miniaturization and power increase of micro-electronic devices are increasing day by day, and the heat generated by electronic devices is rapidly accumulating and increasing. The heat dissipation problem becomes more and more prominent for the stability, reliability and further miniaturization of devices. At the same time, people pay more and more attention to the stability and use experience of products, weather resistance and reliability of electronic products have more demanding requirements, so now more and more electronic products need to use potting adhesive, thermal conductivity potting adhesive can enhance the waterproof ability, seismic ability and heat dissipation performance of electronic products, protect it from the erosion of the natural environment, extend its service life. It shows that the stability and service life of electronic components will decrease by 10% for every 2℃ increase in temperature, and the life of devices at 50℃ is only 1/6 of that at 25℃. Therefore, if we want to ensure the device in the working environment for a long time and reliable operation, we must solve its outstanding heat dissipation problem.
The heat generated by the operation of electronic devices is usually lost by heat conduction. Heat sinks, microcirculation tubes, cooling fans, etc., are usually used to cool microprocessor components. However, due to poor surface contact and roughness mismatch between the heating body (such as an integrated circuit) and the radiator, a large interface thermal resistance is generated, which greatly reduces the efficiency of heat flow conduction. It has been reported that nearly 60% of thermal resistance is due to poor contact. Thermal conductive ceramic materials (such as silicon carbide, boron nitride, aluminum nitride, etc.) although have high thermal conductivity, melting point is extremely high, brittle, difficult to process, and have no flexibility, it is difficult to fill the tiny gap between the interface. Simple polymers (such as silicone rubber, polyvinylidene fluoride, etc.) have good flexibility, good workability and excellent electrical insulation properties, but with low thermal conductivity, it is difficult to meet the heat conduction requirements of devices. At the same time, in addition to high thermal conductivity and high resistivity, high-speed signal transmission of electronic components requires a low dielectric constant, and thermal fatigue resistance requires a low coefficient of thermal expansion.
OSiTC 2320 Thermally Conductive Silicone Encapsulant is a high thermal conductivity potting material with high thermal conductivity (≥3.5W/m·K), electrical insulation, soft and easy to work, low linear expansion coefficient and low dielectric constant, which can basically meet the requirements of the existing high thermal conductivity application field.
Typical Application
OSiTC 2320 Thermally Conductive Silicone Encapsulant is suitable for insulation and heat conduction potting protection of electronics, power modules, high-frequency transformers, connectors, sensors, electric heating parts and circuit boards and other products, and has been statically used in China Electronics Technology Group and other military, aerospace companies of microelectronics components potting and packaging.
We can also provide corresponding thermal conductivity potting solutions according to customers' specific application scenarios and performance requirements. Welcome new and old partners to call for inquiries!
Inquiry hotline: 18761858936, Mr. Bu.
